System Technology Research Engineer – (PhD Intern)

Job Description

Are you a top-tier university student eager to dive into the world of semiconductor innovation? Intel’s Foundry System Technology team is seeking a talented intern to help us push the boundaries of semiconductor and packaging manufacturing technologies.
Our team is dedicated to advancing Moore’s Law, exploring new product opportunities, and leading industry-defining packaging development through System Technology Co-optimisation (STCO).
Position Overview: As a Research Engineer Intern, you will play a crucial role in developing STCO methodology and evaluating 3D/2.5D dis-aggregation schemes using solder microbumps or hybrid bonding for memory and logic stacking across different product architectures. This internship offers a unique opportunity to work on pioneering technologies and contribute to Intel’s semiconductor processing and packaging roadmap.
Perform system-level evaluations of novel devices, interconnects, patterning, materials, systems, and integration schemes.
Collaborate with diverse teams to drive innovation across various applications.
a self-starter who thrives in a dynamic environment and is committed to delivering high-quality results.
Flexible and Adaptable: Comfortable working in an agile environment with a tolerance for ambiguity.
Internship Details: Minimum of 3 months during summer 2026, with potential for extension based on business needs.
Gain hands-on experience with cutting-edge technologies.
Contribute to projects that shape the future of semiconductor processing.
If you’re ready to embark on a journey of innovation and discovery, apply now to join Intel’s Foundry System Technology team. We look forward to welcoming you to a transformative internship experience
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Electrical Engineering, Electronics Engineering, Computer Architecture and Design or similar.
~1-2+ years research experience relevant to one or more of the following areas: System architecture modelling, digital circuit analysis and design, VLSI physical layout, electronic design automation, multi-physics modeling of electronic materials or systems.
~ Familiar with different 2.5D and 3D packaging technologies
~Good programming skills, preferably in Python.

Student / Intern
Shift:
Shift 1 (United States of America)
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.